Schöck Sconnex® - reducing the last major thermal bridge

Roughly 40% of all structural thermal bridges in a building are located at wall and column connections. These bridges are responsible for about 10% of thermal energy losses.

Schöck is also transferring its expertise in thermal insulation of balconies to walls and columns in its new Sconnex® product family. A consistent further development of the successful technology used to minimize thermal bridges, Schöck Sconnex® connectors are milestones for energy-efficient construction and the concept of sustainable buildings.

New developments that bring tangible benefits

Schöck Sconnex® P-type, W-type and M-type can be used for direct and permanent thermal insulation of building elements, especially thermally exposed walls and columns - located in wet rooms, at façade projections, loggias, terraces, arcades and other elements of architectural design. With Schöck Sconnex®, thermal bridges that could not previously be avoided can be effectively insulated. Sconnex® is an effective, elegant and visually appealing solution that provides reliable protection against damage to building structural elements caused by condensation and mold.

Schöck Sconnex®

Schöck Sconnex®

© Schöck

Advantages in a nutshell


- Increased quality and sustainability
- Cost-neutral due to savings in side wall and column insulation
- Reduced thickness of exterior insulation


- Improved appearance by dispensing with side wall and column insulation
- Design freedom for building elements with unfavorable thermal exposure
- Increased design freedom for challenging building geometries

Building physics

- The high temperature of the inner wall surface protects against damage to building structural elements
- Uninterrupted thermal insulation plane provides design certainty
- Increased energy efficiency by reducing the proportion of thermal bridges.

Schöck Sconnex® typu P, W, M

Schöck Sconnex® types P, W, M

© Schöck

For more information, visit the company's SCHÖCK Sp. z o.o. page on the PdD portal.